

liveforphysics wrote:Thin Kapton tape, no adhesive is the best you can do (aside from a thin layer of anodizing). Lap the back of each fet before mounting them on it, and a very slight de-burr on the corners will avoid cutting through the Kapton film. Lap the sink to be flat as well, or you could end up with non-contact pockets that will ruin your conductivity that you could have had with just using the silicone thermal pad.
If you have space, you can also mount each cluster of FETs that are in parallel to a heat spreader, and then separately insulate that heat spreader (which will have greater contact surface to the sink). That's doing way more work for minimal improvement though.


















CamLight wrote:Nicely done!
Yea, mounting TO-220-cased FETs by their tabs is a real pain. The worse part is that the more you tighten the mounting screw, the more the tab warps and the the more the FET lifts off the heat spreader! Add on that commonly used split-rings washers are useless for preventing mounting-screw loosening and those TO-220's drive me crazy (use Belleville washers, stacked, and compressed to 50% of height).![]()
You'd need a new heat spreader, and you might not have room, but the TO-case FET-mounting clips from Aavid, Laird Tech. and others work great. I've used them for TO-220, TO-247 and TO-264 FETs. One great advantage is that the clip mounting screw can be threadlocked in for vibration protection and no worries about overtightening. For additional pressure on the FET, you can "stack" two clips.
http://www.futureelectronics.com/en/tec ... 0000G.aspx (and similar)


zombiess wrote:I've been thinking about building something to squeeze the body of the FETS against the spreader bar to make a sandwich. Since the ceramic bodies aren't conductive I could use aluminum and it would act as even more heat sinking. I'm just trying to think of ways to improve it. Just going to the mica insulators + ceramic compound should be a huge improvement, I didn't go crazy tightening them down, but I am glad to see that the holes on the spreader bar are countersunk which prevents pull up from the threads and holding the whole FET away from the spreader. Jeremy Harris mentioned that after going mica and remounting his controller like this he only had a measured 3 C/W thermal resistance to the FET junction which is pretty darn good.





liveforphysics wrote:I wish you the best of luck with the Nylon screws. I personally see creep making it impossible to hold the desired clamping loads, but I hope I'm mistaken.












liveforphysics wrote:I wish you the best of luck with the Nylon screws. I personally see creep making it impossible to hold the desired clamping loads, but I hope I'm mistaken.


full-throttle wrote:Nice work on getting the most out of the controller!
It may sound like splitting hairs, but have you considered Loctite315 as an alternative to mica?
Its thermal conductivity is marginally better, but the self-shimming thickness is 4x smaller and there's no need for thermal paste.
Just a thought..


The Mighty Volt wrote:@Zombie: thanks for the information and the PM. This looks very sophisticated, to be sure. I am running 4110's so maybe it won't be necessary.





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