dnmun
1 PW
you can look in the wikipedia article on integrated circuit manufacturing under the section at the end under planarization. every large IC manufactured in the world uses my planarization step. you could not afford to buy an IC without it.
since you know nothing about modern electronic manufacturing then you would not know that HP has long since given up on developing new IC manufacturing processes. everyone in my group is long gone.
people like you do not last because the challenge of making a totally new process work is not a challenge like it was for those of us who actually did it.
first three level metal process, first 10 mask process, first 32 bit processor, first tungsten metal CVD, first 1.5uM photo lithography resolution, first i line photo lithography. maybe you have heard of silicides? i doubt it.
first laser wafer scribing and in process wafer monitoring. first automated in process device parameter testing directly tied to wafer number.
first end of line testing direct feedback to in process control steps. everything we did is now standard procedure for every IC manufacturer in the world. my cell mates were chinese and korean and went back to senior positions in taiwan and korea.
we did change the world, not nearly as much as jean hoerni or bob noyce but intel uses all of our experience to this day.
since you know nothing about modern electronic manufacturing then you would not know that HP has long since given up on developing new IC manufacturing processes. everyone in my group is long gone.
people like you do not last because the challenge of making a totally new process work is not a challenge like it was for those of us who actually did it.
first three level metal process, first 10 mask process, first 32 bit processor, first tungsten metal CVD, first 1.5uM photo lithography resolution, first i line photo lithography. maybe you have heard of silicides? i doubt it.
first laser wafer scribing and in process wafer monitoring. first automated in process device parameter testing directly tied to wafer number.
first end of line testing direct feedback to in process control steps. everything we did is now standard procedure for every IC manufacturer in the world. my cell mates were chinese and korean and went back to senior positions in taiwan and korea.
we did change the world, not nearly as much as jean hoerni or bob noyce but intel uses all of our experience to this day.