Am using Kester 63/37 solder with a flux core, love them alot and using them for 3 years now.
I noticed that when I add alot a large drop of solder to a nickel tab or when adding solder to a copper busbar and creating a small "puddle" the flux (I think) bubbles and sometimes throws those super tiny balls of solder around which is stressing the shiz out of me.
Anything I can do to avoid it?
I noticed that when I add alot a large drop of solder to a nickel tab or when adding solder to a copper busbar and creating a small "puddle" the flux (I think) bubbles and sometimes throws those super tiny balls of solder around which is stressing the shiz out of me.
Anything I can do to avoid it?