zombiess
10 MW
Has anyone tried changing out the mosfet electrical insulator over to something better and measured any difference? I talked to Lyen and he said he didn't know exactly what the stuff was rated for that he is using in the controllers (looks like silpad). I have a whole bunch of TO220 Mica insulators which could work well and I just read and and am going to try switching over to it but won't have a before/after results unless I get another stock controller. I'm currently modding this one like Markcycle (details found here http://endless-sphere.com/forums/viewtopic.php?f=2&t=31044&p=449701#p449701) did by connecting the B+ directly to the tabs on each 3 transistor group and then connecting the output phases together by the tabs. I'll post pictures when I'm closer to finished.
I do have some questions though and that is should I parallel the original connections with the new ones or just use the new ones or the old ones. I'm worried about creating inductance (but shouldn't paralleling the bottom traces and the tabs half the inductance and resistance) if the wire is too long, but figure if I keep it short it should be OK. Need someone who is knows EE and power design to answer this one if possible. I'd appreciate it.
This is the post I read.
http://www.diyaudio.com/forums/pass-labs/37262-mica-goop.html
If I was building the board from scratch I'd probably lap the mosfet backs too, but I'm not going to bother desoldering these and go that extreme unless I don't like the look of them when I get the mounting bar off.
I have read that it's not good to reuse silpad after it's been compressed once because it's thermal resistance increases due to the permanent deformation that occurs.
I do have some questions though and that is should I parallel the original connections with the new ones or just use the new ones or the old ones. I'm worried about creating inductance (but shouldn't paralleling the bottom traces and the tabs half the inductance and resistance) if the wire is too long, but figure if I keep it short it should be OK. Need someone who is knows EE and power design to answer this one if possible. I'd appreciate it.
This is the post I read.
http://www.diyaudio.com/forums/pass-labs/37262-mica-goop.html
If I was building the board from scratch I'd probably lap the mosfet backs too, but I'm not going to bother desoldering these and go that extreme unless I don't like the look of them when I get the mounting bar off.
I have read that it's not good to reuse silpad after it's been compressed once because it's thermal resistance increases due to the permanent deformation that occurs.