flathill said:
Wrong. They are many different methods of forced current sharing. You need to match mosfets becuase of of unequal sharing of losses during turn on and turn off. This is because one may be on before all the other in parallel turn off. One solution is drive each transistor with a different delay. Then you no long need to even closely match the mosfets, which are never truly matched anyway as they heat/age. The delay can be tuned in real time with feedback.
I'm not wrong, it's called diminishing returns and it's real. A delay isn't a very good solution for trying to equalize the current sharing either as there is still the problem of having devices in the ohmic region when others might be off or fully on. Another interesting thing the happens in part of the ohmic region is the temperature coefficient is negative not positive as it is when in saturation. It's rare to have a failure due to this from what I have read, but I have personally observed this phenomenon. I do need to test it further as I did not perform it under a sizable load.
I do believe I have come up with at least 2 low cost methods to increase the number of devices which can be paralleled. Needs more testing which means I need to finish up some projects I'm working on.
The main reason MOSFETs parallel so well is not that they have a positive temperature coefficient once on as most people think. It's actually because the manufacturing process produces a high yield of devices with fairly close tolerances. The gate oxide layer thickness between devices is the #1 determining factor how well it will parallel with like devices. The PTC is #2 and close tolerance of RDSon is #3. All of these need to be taken into consideration when trying to scale way out.
The legs on small package MOSFETs with advertised high current are usually the ultimate current limit factor. They get really hot, sometimes hot enough to melt solder and cook the PCB (been there done that). There is also a pretty high loss in the legs when pushing them hard. I've measured the resistance of several MOSFET legs and it's pretty easy to lose 10W per MOSFET at the legs if you push them hard. Big bus bars help pull heat out of the legs based on personal observations.
Cooling multiple small package devices also becomes a challenge as they often do not have favorable Tjc impedance. If the operation of a device is continuous this concern is very high on the list. A reasonable rating for conventional small package devices is < 40A.
The package Liveforphysics posted is interesting.
If it were easy to add a bunch of dice into a module, manufacturers would be coming out with ever higher current handling devices.
Who wants to talk about the massive switching / diode losses many parallel devices have? It can become quite substantial. Sure SiC devices perform with 30-60% less switching losses, but then the penalty for higher cost must be paid. I haven't seen any low RDSon High current SiC devices yet, but I haven't looked hard.
Speaking of switching losses there is also the issue of meeting radiated emissions standards and switching 1000's of amps in 100s of nanoseconds would sure make that interesting.
This is an engineering game. Trade offs must be made. Bus voltage, amps, number of windings in a motor, device package, number of devices, etc.
I just had another thought... how much DC Link cap would be required in order to meet the ripple current demand. I'll probably have more concerns if I think about this for a while. If someone is serious about this they should start crunching numbers and thinking of the problems and ways to overcome them. Just had another, at some point gate drive path could run into EM issues.
Arlo1 said:
As well I've put over 200amps through a TO247 leg for over 10 seconds. The continus rating of 120-160 amps DC with proper cooling is nmo lie!
Stop, put down the Koolaid they have you drinking. You will not be putting 120A continuous (not 10 seconds) through the legs of a TO-247 package continuously without a very extreme cooling method. There is also the matter of the wire bonds and thermal stresses which get applied to the device over it's life span. High stress and temps will shorten the life of the part. Wire bonds can also become an issue.
Datasheets look great, but they are far from reality when it comes to continuous current handling capability. I myself have done ~600A per TO-247 device for a short period.
If you have the time, I would like to see a current test done on different packages. I'd like to see how long they can last with DC at a given DC current for 1 hour.
I'm not against trying to find the balance between high current and high voltage, I want to find solutions to the problems. Poking holes in ideas is how I usually get to my own goals.