ok so.... I was looking ages ago at this SMT FET package, which looks excellent on paper.
https://www.fairchildsemi.com/datasheets/FD/FDBL0240N100.pdf, well I thought I could do better with my layout to make it easier to build, and solder.
so.. Here is a single phase, Phase B goes above this one and so on... The high current path is on the left, where the 10GA wires for Battery + and - will come in and is soldered the full lentgh of the board, this shall be exposed / tinned copper, 5mm width minimum
The -Bat branches for each phase on the bottom of the board, and this can be beefed up with copper wire. The +Bat branches out on the top of the board and can also be beefed up with copper wire..
Now the tricky bit.. The slot, is for a 1mm copper sheet bent into a Z shape to bridge the top layer +VBat to the bottom layer +VBat right into the FETs.
I think this is about as good as I can get it... At least now I have done away with the posts, and managed to get it all on a single plane. I think capacitor placement is pretty good, it's very local to the FETs and the current won't have far to travel to get to the FETs as required.
So thoughts???
The limitation of this layout is the current sensors maxing out at 200A bi directional. But that's still pretty good for a layout that's potentially going to be 60mm wide and around 160mm long...